PCBA capabilities:
• SMT assembly including BGA assembly
• Accepted SMD chips:01005, BGA, QFP, QFN, TSOP
• Component height: 0.2-25mm
• Min distance among BGA :0.3mm with X-ray inspection.
• Min assembly size: (X*Y): 50*30mm
• Max assembly size: (X*Y): 520*570mm
• Pick-placement precision: ±0.01mm
• High pin count press fit available
• SMT capacity per day: 8,000,000 points
• Assembly Option: Surface mount(SMT)&Thru-Hole(THT),Box building, Potting and Coating, In house programming, Packaging
• Board type: Rigid PCB, Flexible PCB, Rigid-flex PCB, Copper PCB,HDI
• Testing: ICT,AOI, X-RAY, Functional Test(FCT),Aging Test
• Quality Standard:IPC-A-610E