Shenzhen Danbond Technology Co.Ltd
Shenzhen Danbond Technology Co.Ltd (Danbond) is a listed company in Shenzhen Stock Exchange (002618). Danbond was established in 2001, with an investment of 180 million RMB. Danbond has been specializing in R&D and manufacturing of flexible circuit and its materials. To date, Danbond has developed a national R&D center for flexible circuit and its materials, and is the biggest supplier starting from design, manufacturing, to service of flexible materials, encapsulation for flexible circuit board, and its related products.
Danbond has its own intellectual rights, including the core technology from manufacturing flexible material, encapsulating flexible circuit to encapsulating chip. Danbond provides the chain service from design, manufacturing, service and solutions for encapsulation. Our main products include flexible FCCL, high-intensity FPC, COF circuit for chips encapsulation, encapsulation products, as well as the encapsulation-related heat curing adhesive and micro adhesive glue film. Those products can be used in high-tech end products, such as in commercial electronics, medical device, special computer, digital display, high-tech equipping industry, national defense, military, and airspace industry.